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选择性焊接设备越来越广泛地应用于 PCB 装配领域。这主要是由于通孔装置设计为板材以及设备投资降低。因为选择性焊接过程与波峰焊接差异很大，Alpha 已开发出各种性能、合格焊接材料供选择性焊接工艺使用。
Alpha 液态助焊剂
| Product | Lead-Free | SnPb | High Reliability | Low Ag | Water Soluble |
| EF-2210 | X | X | X | ||
| EF-5601 | X | X | X | ||
| EF-6000 | X | X | X | ||
| EF-6100 | X | X | X | X | |
| EF-6103 | X | X | X | X | |
| EF-6850HF | X | X | X | ||
| EF-8000 | X | X | X | X | |
| EF-8800HF | X | X | X | ||
| EF-9301 | X | X | X | X |
Alpha 焊接合金
请使用以下表格确定适合您的 Alpha 合金。只需将装配类型与合适合金对应。
| Assembly Type | ||||||||||||
| I | II | III | IV | |||||||||
| Simple, single sided, FR2 / CEM-1 laminates | Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes | Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air | >2.4mm thick, >12 inner copper layers, large high heat capacity components | |||||||||
| SACX Plus 0807 |  | 1%+ flux solids, L0, pin testable | Flux Type | |||||||||
| SACX Plus 0307 | 4%+ flux solids, L or M0, pin testable | |||||||||||
| SnCX Plus® 07 | 4%+ flux solids, L or M0, moderately pin testable | |||||||||||
| 7%+ flux solids, L,M or H1, not pin testable | ||||||||||||
| 0ºC to 100ºC - standard profile cycles | 0ºC to 100ºC - standard and shock profile cycles | - 25ºC to 125ºC - standard and shock profile cycles | - 45ºC to 125ºC - standard and shock profile cycles | |||||||||
| Thermal Fatigue Resistance | ||||||||||||
可靠性解决方案：
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合规性解决方案：
