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在热循环期间,焊料在晶界受到渐进非弹性变形。随着温度变化增加,造成的损坏程度也会增加。Alpha 的焊料由比例最佳的银和锡,以及单晶微结构组成,可增加热循环可靠性。
由于成分不同,某些合金可能会在更加困难的热循环条件下表现出比其他合金更好的热疲劳抗力。在电路板组装行业中公认的一个事实是,银含量更高的无铅合金比银含量较低或不含银的合金更能承受更加恶劣的测试条件。Alpha 围绕最终产品的最终使用环境开发了一系列无铅合金。
焊条合金
使用下图确定哪种 Alpha 合金适合您。只需将进行组装的类型与适当的合金对应起来即可。
Assembly Type | ||||||||||||
I | II | III | IV | |||||||||
Simple, single sided, FR2 / CEM-1 laminates | Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes | Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air | >2.4mm thick, >12 inner copper layers, large high heat capacity components | |||||||||
SACX Plus 0807 | ![]() | 1%+ flux solids, L0, pin testable | Flux Type | |||||||||
SACX Plus 0307 | 4%+ flux solids, L or M0, pin testable | |||||||||||
SnCX Plus™ 07 | 4%+ flux solids, L or M0, moderately pin testable | |||||||||||
7%+ flux solids, L,M or H1, not pin testable | ||||||||||||
0ºC to 100ºC - standard profile cycles | 0ºC to 100ºC - standard and shock profile cycles | - 25ºC to 125ºC - standard and shock profile cycles | - 45ºC to 125ºC - standard and shock profile cycles | |||||||||
Thermal Fatigue Resistance |